See Us At Photonics West 2022

Marktech Exhibiting Their Next Gen Optoelectronics Devices at

Photonics West January 25th to 27th 2022.

October 29, 2021 – Latham, NY, USA – Visit our booth at SPIE Photonics West, the world-renowned event for the photonics, optics, emitters, and detectors field. Marktech Optoelectronics will be showcasing both their well established and newly released products and capabilities such as:

  • Advanced optoelectronic packaging capabilities
    • Chip-scale packaged (CSP) SWIR LEDs
    • Multi-wavelength and multiple chip emitters and detectors
    • ATLAS hermetic SMD packaging
  • Optical detectors
    • Silicon photodetectors
    • InGaAs photodetectors
  • IR sources and detectors
    • Near infrared (NIR) emitters and detectors
    • Short wave infrared (SWIR) emitters and detectors
  • UV sources and detectors
    • UV emitters (UVC LEDs, UVB LEDs, and UVA LEDs)
    • UV enhanced silicon photodiode detectors
  • Wide spectral range optoelectronic device testing services
  • Custom OEM Solutions – Optoelectronics design engineering, device fabrication, and packaging to maximize your total cost benefit
  • Indium Phosphide (InP) epitaxial wafers and compound semiconductor materials
  • Optoelectronic chip design & fabrication (Photodiodes, Phototransistors, Custom Devices)
Marktech Optoelectronics CSP SWIR and Multichip and ATLAS Package Photo.png
Chip-scale SWIR LEDs, Multi-wavelength and Multiple Chip Emitters and Detectors, ATLAS Hermetic SMD Packaging

Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), is a privately-held and veteran-owned leading designer and manufacturer of standard and custom optoelectronics, including UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters, detectors, InP epi wafers, and other compound semiconductors.

Please drop by our booth or contact us any time if you:

  • Have any technical or application questions or need assistance regarding any of your optoelectronic design projects
  • Require validation of the optical characteristics (wavelength, power output, sensitivity) of your current optoelectronics components (emitters or detectors)
  • Are interested in learning more about Marktech’s ATLAS hermetic SMD packaging, silicon photodetectors, InGaAs detectors, chip-scale packaged (CSP) SWIR LED emitters and multi-wavelength or multi-chip packaging
  • Want to schedule a time to consult with our engineering experts at the Photonic West

If you have an urgent project or component questions, contact our application engineers at: [email protected] or call us at 1-518-956-2980.

Marktech Expands Their Innovative Optoelectronics Packaging with Chip-scale SWIR LEDs, Multichips & ATLAS Hermetic SMD

LATHAM, NY, US, October 27, 2021 / — Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held and veteran-owned leading designer and manufacturer of standard and custom optoelectronics, including UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters, detectors, InP epi wafers, and other compound semiconductors, is expanding their innovative optoelectronic packaging with:

  • Chip-scale SWIR LEDs
  • Multi-wavelength and Multiple Chip Emitters and Detectors
  • ATLAS Hermetic SMD Packaging

Chip Scale Packaged SWIR LED Emitters – An Industry First

hip Scale Packaged SWIR LED Emitters – An Industry First
Figure 1 Short Wave Infrared Emitters in a Chip Scale Package (CSP) Introduced by Marktech Optoelectronics – An Industry First.

The availability of SWIR LEDs or emitters in a chip-scale packaged form factor is an industry first. The compactness of the new CSP SWIR LEDs is impressive. A dozen or more of Marktech’s CSP SWIR emitters would fit on the surface of a penny.

These Next-Generation CSP short wave IR emitters have an extremely small footprint compared to conventional short wave IR emitters in surface mount device (SMD) or transistor outline (TO) metal can packages. The new short wave IR emitters consist of a high-performance SWIR chip in an extremely compact 1.6mm x 1.6mm x 1.6 mm cube-shaped SMD package with two lead pads. The flat lens design produces a wide or Lambertian radiation pattern with beam angles of 130°. The high-performance CSP short wave infrared emitter products are available in wavelengths ranging from 1040 to 1650 nm.

1020nm and 1720nm CSP short wave IR emitters are available using conventional, lower power output SWIR chips. Marktech Optoelectronics can provide additional engineering and testing to deliver specific wavelengths and forward voltages as well as tighter power output bands through sorting or epi material customization. In machine vision and inspection, SWIR bandpass filters or longpass filters can be used in conjunction with SWIR light sources and SWIR cameras to adjust the bandwidth or pass only the SWIR light required for imaging – thereby increasing SWIR image contrast and resolution.

The major performance attributes of Marktech’s Chip Scale Packaged SWIR LED Emitters include:

  • Up to double the power output – up to 2X the power output compared to older SWIR LED chips
  • Compact CSP LED size enables high stacking density on a printed circuit board (PCB)
  • Improved SWIR component reliability
  • Increased SWIR component lifetime or mean time between failures (MTBF)
  • Lower thermal resistance compared to plastic leaded chip frame (PLCC) SMD SWIR LEDs

    Marktech Multi-wavelength and Multiple Chip Emitters and Detectors

Marktech Multiwavelength and multiple chip emitter and detector packaging
Marktech’s Multiwavelength and multiple chip emitter and detector packaging

In addition to advanced SWIR LED emitters, Marktech has multichip packaging capabilities, which can combine various NIR and SWIR LEDs and detectors within the same package for multispectral applications such as LED LIDAR and optical ranging sensors. Marktech also provides complementary products such as short wave IR InGaAs detectors for applications requiring both a SWIR light source combined with a SWIR sensor. A series of UV to SWIR emitters in a multichip package can provide a light source with a wide range of wavelengths for spectrometry and hyperspectral imaging. Marktech can bond from 2 to 144 die within the same package.

In summary, Marktech’s multichip packaging processes can provide within the same compact, surface mount, or hermetic package:

  • Multiple wavelength emitters or LEDs with wavelengths from 255 nm to 1720 nm
  • Multiple spectral range detectors
  • Combinations of multiple emitters and detectors

Marktech Optoelectronics can also provide chip-on-board (COB) packaging where multiple chips populate a ceramic or aluminum cored metal clad printed circuit board (Al-cored MCPCB). Chip-on-board (COB) might be the best choice to maximize heat dissipation when a design requires a very dense packaging of multiple emitters or LEDs. Aluminum core COB boards are available in linear, ring, and starboard formats.

ATLAS Hermetic SMD Packaging

High Speed InGaAs PIN Photodiode in ATLAS Hermetic SMD Ceramic Package
Marktech’s High Speed InGaAs PIN photodiode in ATLAS hermetic SMD ceramic package combines vapor and oxygen ingress protection in a surface mount package.

Marktech’s CSP SWIR LED joins a growing family of advanced emitters and detectors in enhanced packaging such as Marktech’s ATLAS packaged line of LEDs, photodetectors, and emitter-detectors. The Marktech revolutionary ATLAS package combines the hermetic characteristics of a TO metal can packaged optoelectronic device with the great manufacturability associated with surface mount devices (SMDs). ATLAS packaged optoelectronic components are available in 3mm x 3mm and 5 mm x 5mm size. The ATLAS hermetic SMD packaging is constructed using a glass to ceramic seam welded process to provide water vapor and oxygen ingress protection.

Multiple wavelength LEDs or emitters and photodetectors can be packaged in the larger ATLAS package. ATLAS is an ideal package for applications requiring extreme sensitivity and high reliability because the seam-welded metal-to-ceramic seal in the ATLAS package prevents the ingress of water vapor and oxygen into the cavity holding the LED chips and photodetectors.

Using the ATLAS package technology, Marktech can engineer hermetic surface mount device (SMD) packages to hold and protect a wide range of SWIR LEDs, SWIR sensors, and custom LED-sensor combinations to your specific SWIR design application requirements in wavelengths ranging from 310 nm to 2600 nm. The hermetically sealed weld on the ATLAS ceramic SMD package provides excellent protection of chips from damaging high humidity environmental conditions. Marktech also has begun to offer standard or catalog products in the hermetic ATLAS package, such as Marktech’s MTSM1346SMF1-100 High-Speed InGaAs PIN Photodiode, which delivers IR to SWIR (600 nm to 1750 nm) photodetection.

Marktech’s Advanced Optoelectronic Packaging Family

In summary, Marktech’s advanced optoelectronic packaging family includes:

  • Chip scale packaging – CSP LED or CSP emitters
  • Hermetic TO-can packaging
  • ATLAS Hermetic SMD Packaging – ingress proof optoelectronics
  • Chip-on-board (COB) packaging using ceramic or Al-cored metal-clad PCB (MCPCB)
  • Multiple chip packaging – Multiple wavelength emitters, photodetectors, and emitter-photodetector combinations

The high compactness and high power output of Marktech’s new CSP infrared LEDs, multichip packages, and ATLAS hermetic SMDs will enable engineers to shrink and enhance their optoelectronic design projects. Their adoption in product development projects will lead to breakthrough designs in many industrial applications.

If you have specific technical or application questions regarding your optoelectronic design project or are just interested in learning more about Marktech’s advanced packaging, emitters, and detectors, then please contact our application engineers: [email protected]

Gary Kardys
Marktech Optoelectronics
+1 518-956-2980
[email protected]

Short Wave Infrared Emitters in a Chip Scale Package (CSP) Introduced by Marktech Optoelectronics – An Industry First

Marktech’s Next Gen CSP Short Wave Infrared LEDs.

September 1, 2021 – Latham, NY, USA – Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held and veteran-owned leading designer and manufacturer of standard and custom optoelectronics, including UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters, detectors, InP epi wafers, and other compound semiconductors, today announced the introduction of chip-scale packaged (CSP) short wave infrared emitters (also known as CSP SWIR LEDs, CSP short wave IREDs, or CSP SWIR emitters).

The availability of SWIR LEDs or emitters in a chip-scale packaged form factor is an industry first. The compactness of the new CSP SWIR LEDs is impressive. In fact, a dozen or more of Marktech’s CSP SWIR emitters would fit on the surface of a penny.

CSP SWIR LED Performance Features

These Next-Generation CSP short wave IR emitters have an extremely small footprint compared to conventional short wave IR emitters in surface mount device (SMD) or transistor outline (TO) metal can packages. The new short wave IR emitters consist of a high-performance SWIR chip in an extremely compact 1.6mm x 1.6mm x 1.6 mm cube-shaped SMD package with two lead pads. The flat lens design produces a wide or Lambertian radiation pattern with beam angles of 130°. Marktech’s chip-scale packaged SWIR LEDs are both RoHS and REACH compliant. The high-performance CSP short wave infrared emitter products are available in wavelengths ranging from 1040 to 1650 nm. The specific SWIR LED wavelengths available include:

1020nm and 1720nm CSP short wave IR emitters are available using conventional, lower power output SWIR chips. Marktech Optoelectronics can provide additional engineering and testing to deliver specific wavelengths and forward voltages as well as tighter power output bands through sorting or epi material customization. In machine vision and inspection, SWIR bandpass filters or longpass filters can be used in conjunction with SWIR light sources and SWIR cameras to adjust the bandwidth or pass only the SWIR light required for imaging – thereby increasing SWIR image contrast and resolution.

The major performance attributes of Marktech’s CSP short wave infrared emitters include:

  • Up to double the power output – High-performance SWIR LED dies in the CSP package provide up to 2X the power output compared to older, conventional SWIR LED chips
  • Compact CSP LED size enables high stacking density on a printed circuit board (PCB) due to the small 1.6mm X 1.6mm footprint
  • Improved SWIR component reliability
  • Increased SWIR component lifetime or mean time between failures (MTBF)
  • Lower thermal resistance compared to plastic leaded chip frame (PLCC) SMD SWIR LEDs

Reliability increases originate from several facets of the chip-scale packaged SWIR LED design. First, the advanced SWIR die itself contributes to improved reliability.

Second, Marktech’s CSP packaged SWIR LED SMD combines aspects of high power emitter packaging with typical LED chip-scale packaging to create a new high power chip-scale package SMD (HP CSP SMD).

The high-power (HP) SWIR LED packages utilize a low thermal resistance ceramic submount to rapidly dissipate heat. The high thermal resistance in plastic leaded chip carriers (PLCC) SMD LEDs results in poor heat dissipation and reduced performance.

Ceramics are typically 10 times higher in thermal conductivity compared to plastics. The ceramic submount in the Marktech’s CPS SWIR LED provides a powerful “heat slug” for reduced thermal resistance, enhanced heat dissipation, and an overall improvement in reliability. The large contact area of the anode and cathode pads on the bottom of the CSP SWIR SMD package provide lower resistance electrical and thermal conduction paths.

CSP SWIR LED Applications

Short wave infrared emitters have become important components empowering advanced designs in aerospace, automotive, medical, imaging, spectroscopy, microscopy, night vision, security, defense, agriculture, semiconductor, industrial, and communications applications.

Certain materials such as silicon, which are normally opaque in the visible band, are transparent in the SWIR wavelength region. Some materials, biological samples, and organic compounds have enhanced contrast or exhibit fluorescence when imaged in the SWIR band. In medical applications, SWIR imaging systems have been developed to detect cancers, non-invasively measure blood glucose, and diagnose inner ear conditions (otoscopes).

In semiconductor applications, SWIR microscopes and inspection systems more efficiently detect defects on the surface of silicon wafer surfaces. SWIR vision systems and digital sorters utilize the contrast differences between various materials and natural compounds to detect contamination in grains, nuts, seeds, and other food products.

Shadowing is more pronounced under SWIR light and therefore the shape and form of parts and their features are more easily determined, which is useful for machine vision, surface metrology, and optical gaging system applications.

SWIR cameras, SWIR microscopes, SWIR spectrometers, SWIR endoscopes, SWIR hyperspectral machine vision systems require consistent, spatially homogeneousness SWIR light sources with high power output or intensity. The combination of high power output in a denser concentration on a PCB or ring board has the potential to improve image quality, signal-to-noise ratio, and detection efficiency in spectroscopy or chemical analysis, microscopy, imaging, wafer inspection, and vision systems. High uniformity SWIR light source illumination of a surface can be attained at short working distances with denser PCB stacking of Marktech’s compact CSP SWIR LEDs.

SWIR cameras, SWIR detectors, and SWIR LIDAR systems can “see” through obscured environments such as rain, fog, clouds, plastics, and organic materials. Marktech’s SWIR InGasAs detectors in combination with CSP SWIR LEDs can provide compelling advantages in collision avoidance and autonomous vehicle detection applications in the automotive, aerospace, defense, and security industries. Unlike conventional thermal imagers and infrared cameras for night vision, SWIR camera image sensors and SWIR detectors are not overwhelmed or “blinded” by daylight infrared radiation from the sun, which means SWIR cameras and SWIR detectors can be used day and night in surveillance, agricultural crop sensing, and defense applications.

CSP SWIR LED Design Advantages

These new SWIR components are ideal for optoelectronic design projects demanding increased miniaturization or compactness combined with enhanced longevity, dependability, and power output performance.

The potential design benefits of Marktech’s CSP short wave IR emitter technology includes:

  • Miniaturization – the small footprint and reduced height of CSP SWIR LEDs will allow design engineers to reduce the size of SWIR cameras, SWIR spectrometers, SWIR microscopes, SWIR machine vision systems
  • Higher Intensity – the ability to use more SWIR LEDs per unit area in combination with the higher power output of each advanced SWIR emitter results in an increase in total power output and intensity.
  • Improved Uniformity – the use of a larger number of SWIR LEDs across an area should provide a more uniform short wave infrared light source even at closer working distances.
  • Increased System Reliability – the higher lifetime and reliability of Marktech’s CSP SWIR emitters should contribute to improved system reliability.

For multispectral camera and machine vision applications, combinations of NIR-vis and SWIR broadband LEDs can be packaged to provide light sources custom matched to the spectral response of specific hyperspectral cameras. CSP multispectral LED light sources have the additional advantage of lower operating temperature and power consumption compared to hyperspectral Halogen light sources.

CSP SWIR LED Thermal Management and Board Design

While CSP SWIR LEDs have many performance advantages, chip-scale packaged LED SWIR designs with high packing densities can overcome the heat dissipation ability of FR4 printed circuit board materials. When compared to visible light emitters, SWIR LEDs tend to be less efficient and will generate more heat under the same current or power loads. Printed circuit boards with high stacking densities of SWIR LEDs should have an array of thermal vias or even a thermal pad and additional heat sinks on the underside to help improve the thermal performance. A ceramic or aluminum cored metal clad printed circuit board (Al-cored MCPCB) or a chip-on-board (COB) might be the best choice to maximize heat dissipation. Marktech can provide dense-packed boards populated with SWIR LED emitters on ceramic or aluminum cored PCBs.

Marktech’s engineering experts can provide thermal management analysis and design of your SWIR boards and modules to assure your SWIR LEDs and SWIR detectors stay within operating temperature limits. Thermal management requirements are determined by understanding the interaction of ambient temperature fluctuations, heat generation from the SWIR LED, and heat dissipation characteristics of the assembled PCB or module. If the operating temperature still exceeds the specified limits, then a derating analysis can be performed to determine the reduced lifetime and operating current values.

In addition to advanced optoelectronics packaging, Marktech has a well-established and industry respected capability in both board and module design, thermal management engineering, and testing to validate the optoelectronic performance characteristics of incoming optoelectronic devices as well as the realized designs or finished products.

Marktech’s Advanced Optoelectronic Packaging Family

In addition to advanced SWIR LED emitters, Marktech Optoelectronics has additional infrared emitters within the near IR (NIR) and mid-IR (MIR) bands. Marktech can combine various NIR and SWIR LEDs and detectors within the same package for multispectral applications such as LED LIDAR and optical ranging sensors. Marktech also provides complementary products such as short wave IR InGaAs detectors for applications requiring both a SWIR light source combined with a SWIR sensor.

Marktech’s CSP SWIR LED joins a growing family of advanced emitters and detectors in enhanced packaging such as Marktech’s ATLAS packaged line of LEDs, photodetectors, and emitter-detectors. The Marktech revolutionary ATLAS package combines the hermetic characteristics of a TO metal can packaged optoelectronic device with the great manufacturability associated with surface mount devices (SMDs). 

Multiple wavelength LEDs or emitters and photodetectors can be packaged in the larger ATLAS package. ATLAS is an ideal package for applications requiring extreme sensitivity and high reliability because the seam-welded metal-to-ceramic seal in the ATLAS package prevents the ingress of water vapor and oxygen into the cavity holding the LED chips and photodetectors.

Using the ATLAS package technology, Marktech can engineer hermetic packages to hold and protect a wide range of SWIR LEDs, SWIR sensors, and custom LED-sensor combinations to your specific SWIR design application requirements. Marktech also has begun to offer standard or catalog products in the hermetic ATLAS package, such as Marktech’s MTSM1346SMF1-100 High-Speed InGaAs PIN Photodiode, which delivers IR to SWIR (600 nm to 1750 nm) photodetection.

In summary, Marktech’s advanced optoelectronic packaging family includes:

  • Chip scale packaging – CSP LED or CSP emitters
  • Hermetic TO can packaging
  • ATLAS hermetic surface mount device (SMD) packaging
  • Chip-on-board (COB) packaging using ceramic or Al-cored metal-clad PCB (MCPCB)
  • Multiple chip packaging – Multiple LEDs, photodetectors, and emitter-photodetector combinations

Conclusion & Next Steps

The high compactness and high power output of Marktech’s new chip-scale short-wave infrared LEDs will enable engineers to shrink and enhance their optoelectronic SWIR design projects. Adoption of CSP SWIR LEDs in new products under development will likely lead to breakthrough designs in many industrial applications.

If you have specific technical or application questions regarding your short wave infrared design project or are just interested in learning more about Marktech’s CSP SWIR LEDs or emitters, then please reach out to us through the following:

New Broadband Hybrid Silicon-InGaAs Photodetectors

Broadband hybrid Silicon-InGaAs photodetectors | Marktech Optoelectronics, Inc.

Cost- and Space-Saving Design Eliminates the Need for Separate Detectors within the Same Application

October 29, 2019 – Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held, VOSB-certified, leading designer and manufacturer of standard and custom optoelectronics components and assemblies, including ultraviolet (UV), visible (VIS), near-infrared (NIR), and short-wave infrared (SWIR) emitters, detectors, InP epiwafers and other materials, today announced the global market introduction of its Models MT03-041 (TO-5) and MT03-047 (SMD), two new broadband hybrid Silicon-InGaAs photodetectors.

The
industry-exclusive design of the Models MT03-041 and MT03-047 ensures
versatile, accurate, reliable broadband detection over spectral ranges from UV-to-VIS-to-SWIR,
with 250 nm (UV) to 1750 nm (SWIR) enhanced sensitivity. This wide dynamic
range includes 365 nm blue-green enhanced Silicon-based and 1300 nm InGaAs-based
detection, respectively; ultra-low-noise measurement performance; and high
shunt resistance. The detectors are seamlessly integrated within a single,
compact thru-hole or SMD package. They are also both REACH and RoHS compliant.

Small-to-medium-sized
quantities of standard Models MT03-041 (TO-5) and MT03-047 (SMD) are typically
available with 24-hour shipment from stock via Marktech global distribution partner, Digi-Key Electronics. Optional
accessories for Models MT03-041 (TO-5) and MT03-047 (SMD), also available from
Marktech, include UV-to-IR-to-SWIR range emitters. Each emitter may be
mechanically and spectrally matched, then combined with the photodetector as a
single, compact package. Custom designs may be produced in as few as 6-8 weeks
from customer prototype approvals. Please consult Marktech’s Latham, New York global
corporate headquarters and R&D center for assistance.

Typical applications for Marktech broadband hybrid Silicon-InGaAs photodetectors include medical, industrial, high-speed communications, security and spectroscopy. For more information about Models MT03-041 (TO-5) and MT03-047 (SMD), or other products and services available from Marktech, visit www.marktechopto.com.

-###-

Founded in 1985, Marktech Optoelectronics has built a strong industry pedigree for R&D excellence. As a renowned optoelectronics engineering, design, manufacturing and test facility, Marktech’s unique core competencies are rooted in its proven capabilities to produce custom LEDs, detector components and assemblies in virtually any sized quantity. Each is designed and manufactured to customer exacting standards and is available with some of the industry’s most competitive lead times. The company’s engineering team also has the necessary full in-house capabilities for the testing of complete electrical and optical characteristics, as well as to perform end-to-end examinations of all optical components, from die level to finished product designs. Marktech is the only known manufacturer within the optoelectronics sector to have achieved U.S. veteran-owned small business (VOSB) certification status. The company is also a Cree Solution Provider for high-brightness LEDs and materials, as well as a member of AIM Photonics.

PR Author/Editorial and Advertising Inquiries:
Ms. Molly Bakewell Chamberlin
President / Optoelectronics Industry Subject Matter Expert
Embassy Global LLC
Tel: +1.800.309.6150
[email protected]

Marktech Expands Surface Mount SWIR Reflective Sensor Offerings

Marktech Optoelectronics Surface Mount Reflective Sensor

October 2, 2019 – Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held, VOSB-certified, leading designer and manufacturer of standard and custom optoelectronics components and assemblies, including UV, visible, near-infrared, and short-wave infrared (SWIR) emitters, detectors, InP epiwafers, and other materials, today announced the recent expansion of its industry-exclusive surface mount (SMD) SWIR reflective sensor family.

The superior alignment and sensitivity of Marktech’s surface mount SWIR reflective sensor offerings make them ideal for position sensing and detection applications, including card, barcode, edge sensing and money bill readers.

Marktech surface mount SWIR reflective sensors combine both a short wavelength infrared emitter and a high-sensitivity InGaAs photodiode. Emitted light from the Marktech sensor is reflected back to the detector side as an object enters the sensing area, with an optimal short detection distance of 0.5 to 1.5 mm.  The series is offered in six standard models, each with its own unique peak emission wavelength from 1040 to 1625 nm. Each element is spectrally and mechanically matched and then seamlessly integrated within a single, compact, 4-pad SMD black molded housing. The black housings are designed to help reduce the risks of measurement uncertainty created by external ambient light effects. The series’ overall footprint measures just 5.1 mm x 3.3 mm, facilitating its ease of installation within space constrained environments. Units are both REACH and RoHS compliant.

Small-to-medium sized quantities of standard surface mount SWIR reflective sensor models are typically available with 24-hour shipment from stock via Marktech’s longtime distribution partner, Digi-Key Electronics. Sensor customization is also available upon request, in quantities ranging from prototypes to OEM volumes. Full production volumes are typically available within just 6-8 weeks from customer prototype approvals. Please consult Marktech’s Latham, New York-based R&D center for technical assistance.

Founded in 1985, Marktech Optoelectronics has built a strong industry pedigree for R&D excellence. As a renowned optoelectronics engineering, design, manufacturing and test facility, Marktech’s unique core competencies are rooted in its proven capabilities to produce custom LEDs, detector components and assemblies in virtually any-sized quantity. Each Marktech product is designed and manufactured to customer exacting standards and is available with some of the industry’s most competitive lead times. The company’s engineering team also has the necessary full in-house capabilities to perform complete electrical and optical characteristics testing, as well as end-to-end examinations of all optical components, from die level to finished product designs. In addition, Marktech is an authorized Solution Provider for Cree high-brightness LEDs and materials and is a member of AIM Photonics. For more information about surface mount SWIR reflective sensor offerings, or other products available from Marktech Optoelectronics, visit www.marktechopto.com.

Click here to view our standard SWIR reflective sensor offerings.

PR Author/Editorial and Advertising Inquiries:
Ms. Molly Bakewell Chamberlin
President / Optoelectronics Industry Subject Matter Expert
Embassy Global LLC
Tel: +1.800.309.6150
[email protected]

Marktech Expands Standard Silicon Photodiode Offerings to Include New Processes, Active Area Sizes, Case Isolation, and Package Options

Marktech Optoelectronics Standard Silicon Photodiode

August 12, 2019 – Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held, VOSB-certified, leading designer and manufacturer of standard and custom optoelectronics components and assemblies, including UV, visible, near-infrared (NIR), and short-wave infrared (SWIR) emitters, detectors, InP epiwafers, and other materials, has expanded its standard Silicon photodiode offerings to include additional processes, active area sizes, case isolation and packaging options.

Marktech customers can now choose from among four unique processes to accommodate an expanded range of UV and NIR applications. These include the 365 nm UV-enhanced Series 4, for spectral ranges of 300 nm to 1100 nm, further offered in an additional 7.5 mm2 active area size; the general-purpose Series 8, for spectral ranges of 350 nm to 1100 nm; and the UV- and NIR-enhanced Series 11, for spectral ranges of 254 nm to 1100 nm. In terms of new standard mounting options, customers can now specify surface mount units for automated pick-and-place capabilities, in addition to the existing choice of TO-46 (3-pin) or TO-5 (2-pin and 3-pin) metal can package. TO-metal can packages may be further case isolated for reduced noise.

These latest additions to the Marktech standard Silicon photodiode family have been made in direct response to customer feedback, joining the also-recently introduced Silicon avalanche photodiodes and broadband PIN photodiodes. All Marktech Silicon photodiodes feature high sensitivity, low noise, and low dark current, and are both REACH and RoHS compliant. Small-to-medium sized quantities of standard Silicon photodiodes are typically available with 24-hour shipment from stock via Marktech’s longtime distribution partner, Digi-Key Electronics.

Beyond standard product, Marktech Silicon photodiodes are available with a full range of supporting NIR and point source emitters. The photodiodes and LED emitters may be supplied, either as separate stand-alone components; or, combined into a seamless, mechanically and spectrally matched package, such as a reflective switch. Most custom and hybrid designs from Marktech are available in as few as 6-8 weeks from point of prototype approval and may be produced in virtually any-sized quantity, from prototype to OEM volumes. 

Typical applications for Marktech Silicon photodiodes include colorimeters, spectroscopy equipment, fluorescence, photometers, and analytical equipment, within industries such as medical, laboratory and university research, aerospace, robotics, and industrial automation. Please consult Marktech’s Latham, New York-based R&D center for applications engineering and custom product development assistance.

Founded in 1985, Marktech Optoelectronics has built a strong industry pedigree for R&D excellence. As a renowned optoelectronics engineering, design, manufacturing, and test facility, Marktech’s unique core competencies are rooted in its proven capabilities to produce custom LEDs, detector components and assemblies in virtually any-sized quantity. Each Marktech product is designed and manufactured to customer exacting standards and is available with some of the industry’s most competitive lead times. The company’s engineering team also has the necessary full in-house capabilities to perform complete electrical and optical characteristics testing, as well as end-to-end examinations of all optical components, from die level to finished product designs. In addition, Marktech is a Cree Solution Provider for high-brightness LEDs and materials. The company is also a member of AIM Photonics. For more information about Marktech and its Silicon photodiode product offerings, visit www.marktechopto.com.

Product Page Link: https://marktechopto.com/marktech-detectors/silicon-photo-detectors/

PR Author/Editorial and Advertising Inquiries:
Ms. Molly Bakewell Chamberlin
President / Optoelectronics Industry Subject Matter Expert
Embassy Global LLC
Tel: +1.800.309.6150
[email protected]

Marktech Optoelectronics Awarded Veteran-Owned Small Business Certification

Marktech Veteran Owned Small Business Certification

July 23, 2019 – Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held designer and manufacturer of standard and custom optoelectronics components and assemblies, including UV, visible, near-infrared, and short-wave infrared emitters, detectors, InP epiwafers, and other materials, for aerospace, automotive, industrial automation, in-laboratory R&D, medical, robotics, sensors, wearables, telecommunications, and other applications, today announced the achievement of its veteran-owned small business certification (VOSB).

This Marktech VOSB certification, awarded by the United States Department of Veteran Affairs (VA) Office of Small and Disadvantaged Business Utilization, via its Center for Verification and Evaluation (CVE), follows the company’s successful completion of a nearly year-long stringent application process. Over the next three years, this certification affords Marktech new eligibility under the Veterans First Contracting Program for VA federal contracting opportunities and related set asides, and with subsequent potential for certification renewal.

Marktech is the only known U.S. optoelectronics manufacturer to currently have such a distinction.

Notes Marktech CEO, Mark Campito, “Speaking equally, as both a proud U.S. Navy veteran, who originally enlisted under the G.I. bill, and a proud 40-year veteran of the optoelectronics manufacturing industry, this certification brings with it a special sense of honor, as it combines both of those rewarding histories in a truly innovative way. Marktech looks forward to the prospect of new opportunities to grow our business with the federal government now afforded to us with this certification. At the same time, we remain grateful to the many OEMs who champion diversity initiatives within their supply chains, including for U.S. veteran-owned small businesses like ours.”

The VA’s Veterans First Verification Program affords verified firms which are owned and controlled by veterans and service-disabled veterans the opportunity to compete for VA set asides. During verification, the CVE verifies SDVOSBs/VOSBs according to the tenets found in Title 38 Code of Federal Regulations (CFR) Part 74 and 13 CFR Part 125 that address veteran eligibility, ownership, and control. In order to qualify for participation in the veterans First Contracting Program, eligible SDVOSBs/VOSBs must first be verified. Applicants are verified in four unique stages: intake, assessment, federal review and decision.

Founded in 1985, the Latham, New York-based Marktech Optoelectronics has built a strong industry pedigree for R&D excellence. As a renowned optoelectronics engineering, design, manufacturing and test facility, Marktech’s unique core competencies are rooted in its proven capabilities to produce custom LEDs, detector components and assemblies in virtually any-sized quantity. Each Marktech product is designed and manufactured to customer exacting standards and is available with some of the industry’s most competitive lead times. The company’s engineering team also has the necessary full in-house capabilities to perform complete electrical and optical characteristics testing, as well as end-to-end examinations of all optical components, from die level to finished product designs. In addition, Marktech is an authorized Solution Provider for Cree high-brightness LEDs and materials and is a member of AIM Photonics. For more information about Marktech and its available offerings, contact us here.

PR Author/Editorial and Advertising Inquiries:
Ms. Molly Bakewell Chamberlin
President / Optoelectronics Industry Subject Matter Expert
Embassy Global LLC
Tel: +1.800.309.6150
[email protected]

Marktech Announces Successful InP Epitaxial Crystal Technology Development for Ultra-High-Speed (5G) Large-Capacity Signal Processing Applications

InP epitaxial crystal

April 24, 2019 – Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held, veteran-owned leading designer and manufacturer of standard and custom optoelectronics components and assemblies, including UV, visible, near-infrared, and short-wave infrared emitters, detectors, InP epiwafers and other materials, today announced its successful in-house development of InP epitaxial crystal mass production technologies for ultra-high-speed (5G) large-capacity signal processing applications.

The Marktech R&D efforts were carried out under the direction of Dr. Gako Araki, a 25-year expert in ultra-high-speed InP HBT and HEMT epitaxial crystal growth technologies. A member of the Marktech team since 2010, Dr. Araki’s experience further includes a progressive series of related R&D tenures at the New Energy and Industrial Technology Development Organization (NEDO) and NTT Advance Technology Corporation, both in Tokyo, Japan.

Research was carried out in two distinct phases. Phase One consisted of ultra-high-speed (5G) lnP epitaxial crystal growth technology development using small prototype MOCVD equipment (4inch.x4). Phase Two consisted of actual ultra-high-speed (5G) lnP epitaxial crystal manufacturing using large mass-production MOCVD equipment, known as GAKOUS (4inch.x10).  Given that true lnP-HBT epitaxial crystal performance testing requires electrical characteristic evaluations on larger HBT devices, Marktech instead focused R&D efforts on the development of new manufacturing equipment which could produce InP-HBT epitaxial crystals with the necessary uniform quality, size and quality for large-capacity ultra-high-speed (5G) signal processing applications. These goals were successfully achieved via a new crystal manufacturing method: carbon-doped InGaAs growth without hydrogen.

The Marktech evaluation of the small MOCVD prototype derived from this equipment showed favorable performance characteristics. Marktech then performed successful high-frequency HBT electrical characterizations on the prototype with equally favorable results. As a result, Marktech was able to conclude its successful development of new lnP HBT epitaxial crystal growth production equipment, known as MOCVD GAKOUS, whose capabilities offer the necessary prototype growth technology reproducibility and uniformity for manufacturing quality control in ultra-high-speed (5G) lnP epitaxial crystal growth applications.

As a final accompaniment to this R&D, Marktech developed a series of non-destructive electron mobility measurement systems. This included time-resolve photoluminescence testing with infrared wavelength area measurements, a technique which proved useful in the performance of lnGaAs channel layer quality checks, as well as HBT gain estimates by p-lnGaAs base layers during crystal growth and production. Using these techniques, it was determined that the Marktech small MOCVD prototype 4inchx4 exhibited satisfactory performance with new organic materials, independent source injection and a narrow gap placed between the injector and surface to avoid complex surface reactions. As a result, Marktech developed its new MOCVD GAKOUS equipment to produce lnP epitaxial crystal material which could offer the same performance and reliability as that of the prototype, yet with sufficient quality and uniformity for larger-scale commercial lnP HBT and HEMT crystal production volumes.

Of this research, Marktech CEO, Mark Campito, notes, “Marktech is proud of the R&D work of Dr. Araki in the area of InP epitaxial crystal mass production technologies for ultra-high-speed (5G) large-capacity signal processing. Our team’s commitment to proactive R&D efforts that address diverse or emerging market sector needs has been well-demonstrated over the years, whether that’s a 5G application, LiDAR, wearables, or others. We look forward to working in partnership with key 5G industry players to help them achieve their device performance goals.”

Founded in 1985, Marktech Optoelectronics has built a strong industry pedigree for R&D excellence. As a renowned optoelectronics engineering, design, manufacturing, and test facility, Marktech’s unique core competencies are rooted in its proven capabilities to produce custom LEDs, detector components and assemblies in virtually any-sized quantity. Each Marktech product is designed and manufactured to customer exacting standards and is available with some of the industry’s most competitive lead times. The company’s engineering team also has the necessary full in-house capabilities to perform complete electrical and optical characteristics testing, as well as end-to-end examinations of all optical components, from die level to finished product designs. Marktech is also a Cree Solution Provider for high-brightness LEDs and materials and is a member of AIM Photonics. For more information about Marktech Optoelectronics and its product offerings, visit www.marktechopto.com.

PR Author/Editorial and Advertising Inquiries:
Ms. Molly Bakewell Chamberlin
President / Industry Subject Matter Expert
Embassy Global, LLC
Tel: +1.800.309.6150
[email protected]

Marktech Optoelectronics Announces Multi-wavelength Emitters, Detectors and LEDs for Wearables

Marktech Optoelectronics Wearables

December 3, 2018 – Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held and veteran-owned leading designer and manufacturer of standard and custom optoelectronics components and assemblies, including UV, visible, near-infrared (NIR), and short wavelength infrared (SWIR) emitters, detectors, InP epiwafers and other materials, today announced its dedicated offerings for wearables.

Marktech’s standard and custom emitters and detectors, in both multi-wavelength and hybrid designs and in UV, visible, infrared, and SWIR ranges, are routinely specified within consumer- and hospital-grade flexible, stretchable and wearable devices. Some of the most common wearable applications supported by Marktech include consumer-grade fitness trackers; high-end cardiac, oxygen, and blood pressure monitors; audiological diagnostic devices, used to detect inner ear abnormalities and damage; non-invasive optical chemical sensing; and indoor/outdoor UV-level detection.

For wearable designs requiring more advanced onboard monitoring and detection capabilities, Marktech offers a number of multi-wavelength emitter-detector combinations. These combinations may be seamlessly integrated into a single package along with a multi-wavelength range detector. In addition, Marktech’s Silicon and InGaAs photodetectors may be similarly combined with its GaP Schottky UV photodiodes, creating an expanded spectral detection range of approximately 150 nm to 1750 nm. Optoelectronics assemblies are available in plastic, ceramic, and glass-to-metal (hybrid) package types. A number of options are also available to effectively address specialty requirements for hermetic sealing, temperature extremes, and humid or moisture-rich environments.

In addition, Marktech high-brightness LEDs and LED emitters are routinely specified for wearable displays and remote physiological monitoring requirements. Standard LED emitters are offered in wavelengths from 280 nm to 1720 nm, with expanded wavelengths by special request. These Marktech LED emitters can be further optimized for low power consumption. Such optimizations can result in increased wearable device battery life, while still maintaining required output levels. The achievement of operating currents of 2 mA or less are also possible. In applications requiring the incorporation of a white LED, an assortment of color temperature and CRI are available, as well as lower-profile direct-attach (DA) type chip packages. Please consult the Marktech R&D team for applications engineeering assistance.

All design and testing of Marktech optoelectronics components and assemblies is conducted from the company’s worldwide R&D center in Latham (Albany), New York, USA. There, Marktech is able to design, develop, manufacture and test optoelectronics components to customer exacting standards. Each new wearables design draws upon Marktech’s own vast portfolio of related success stories and applies the acquired value-added expertise of lessons learned. Wearable optoelectronics components from Marktech may be produced in virtually any sized quantity, from prototype to OEM volumes, with competitive lead times. Marktech also has the necessary full in-house capabilities to perform complete electrical and optical characteristics testing, from die-level to finished product designs, as well as complete end-to-end examinations of related components and assemblies. Wearables-specific applications engineering support is also available from one of the industry’s most experienced teams.

Contact us today for an applications assessment.

PR Author/Editorial and Advertising Inquiries:
Molly Bakewell Chamberlin
President / Industry Subject Matter Expert
Embassy Global, LLC
Tel: +1.800.309.6150 -or- +44 (0) 2030 148924
[email protected]
www.embassyglobalpr.com

Marktech Optoelectronics Introduces InGaAs/InP Broadband PIN Photodiodes

Marktech Optoelectronics Broadband InGaAs PIN Photodiodes

Supporting High-Speed Communications, Autonomous Vehicles,
Industrial Controls, LIDAR and Wearables

Latham, NY, USA  Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held, VOSB-certified leading designer and manufacturer of standard and custom optoelectronics components and assemblies, including UV, visible (VIS), near-infrared (NIR), and short-wave infrared (SWIR) emitters, detectors, InP epiwafers and other materials, today announced the global market introduction of the Model MTPD1346D-xx series, a family of InGaAs/InP broadband PIN photodiodes.

Marktech InGaAs/InP PIN photodiodes are designed to effectively convert broadband light into photocurrents within the VIS-SWIR range. In addition to their low noise, high sensitivity and high-speed response, they feature wide standard spectral ranges of 0.6 μm to 1.7 μm (1.7 μm material), low dark current, and high efficiency, typically 0.6A/W. Standard Model MTPD1346D-xx series broadband PIN photodiodes are offered in active area sizes from 0.1 mm to 3.0 mm. Each is packaged within a hermetically sealed, 3-pin TO-46 metal can with flat lens cap, and with choice of either thru-hole or surface mounting.

Small-to-medium-sized quantities of standard broadband PIN photodiodes are typically available with 24-hour shipment from stock via Marktech’s longtime distribution partner, Digi-Key Electronics. In addition, the photodiodes may be seamlessly integrated, together with Marktech SWIR emitters, as a single, compact package. Such custom and hybrid designs may be produced in as few as 6-8 weeks from customer prototype approvals. Please consult Marktech’s Latham, New York corporate headquarters and R&D center for assistance.

Marktech MTPD1346D-xx series InGaAs/InP broadband PIN photodiodes are designed to effectively support a diverse array of applications, particularly where high-speed performance, high data rates, low dark current, small capacitance, and smaller active area sizes are required.  Typical applications include aerospace, automation, autonomous vehicles, high-speed communications, industrial controls, LIDAR, medical, material and chemical analysis, security, and wearables, among others.

Founded in 1985, Marktech Optoelectronics has built a strong industry pedigree for R&D excellence. As a renowned optoelectronics engineering, design, manufacturing and test facility, Marktech’s unique core competencies are rooted in its proven capabilities to produce custom LEDs, detector components and assemblies in virtually any-sized quantity. Each Marktech product is designed and manufactured to customer exacting standards and is available with some of the industry’s most competitive lead times. The company’s engineering team also has the necessary full in-house capabilities to perform complete electrical and optical characteristics testing, as well as end-to-end examinations of all optical components, from die level to finished product designs. Marktech is also a Cree Solution Provider for high-brightness LEDs and materials.

For more information about InGaAs/InP broadband PIN photodiodes, or other products from Marktech Optoelectronics, please click here.

PR Author/Editorial and Advertising Inquiries:
Molly Bakewell Chamberlin
President / Industry Subject Matter Expert
Embassy Global, LLC
Tel: +1.800.309.6150
[email protected]
www.embassyglobalpr.com