The broadest line of both silicon and InGaAs detectors commercially available.
Indium Gallium Arsenide (InGaAs) PIN photodiodes are made using InGaAs/InP technology.
Cutting-edge silicon photodetectors that excel in precise detection of light ranging in wavelength from 250nm to 1100nm
Monolithic “quads” or quadrant photodiodes (QPDs) are 2 X 2 photodiode arrays with four planar diffused photodiode elements or segments.
Marktech offers a broad line of silicon photo Transistors in a variety of package types ranging from miniature metal can to ceramic packages.
Our High-Reliability Photoreflectors are sensors that contain both the LED emitter and photodetector functions within a single package.
Marktech Si APD’s offer low-level light and short pulse detections of wavelengths between 400 nm and 1100 nm.
UV detectors are offered in a variety of TO metal-can type packages from TO-18 to TO-39 with special UV glass lens to insure optimum lifetime and the least amount of material degradation
With the ability to detect light in the UV, visible, and infrared spectrums, photo detectors, photo transistors, and photodiodes are being used in increasingly more applications.
Marktech offers the broadest range of emitters commercially available ranging from 235nm to 4300nm across the UV, visible, NIR, SWIR, and MWIR spectral ranges.
Marktech offers the broadest range of UV LEDs commercially available ranging from 235nm to 400nm including UVA, UVB, UVC, and deep UVC LEDs.
Our advanced line of visible LED products is engineered to deliver high-quality, energy-efficient lighting solutions across various applications from 400nm to 700nm..
Our NIR LED wavelength range is typically from 700nm to 1000nm, extending into wavelengths invisible to the human eye but crucial for numerous technological and scientific applications.
Our standard product offering includes wavelengths from 1020nm to 4300nm and operating currents ranging from 20mA to 350mA for high-power applications.
Our Point Source LEDs are specifically engineered for optical encoders, edge sensors, and other critical applications that demand highly focused light with minimal dispersion.
Multi-LED chips in a single package, our multiple wavelength LEDs are engineered to address a myriad of applications across the UV, visible, NIR, SWIR, and MWIR spectral ranges
Designed to produce a highly defined red dot or reticle, facilitating accurate aiming without revealing the location to the target.
Ideally suited for applications including edge sensing, line sensing, coin bill validation, and bar code reading
Our panels are crafted to deliver uniform, vibrant illumination across a wide range of applications, from consumer electronics to industrial displays.
Crafted with the latest LED technology, these rings provide adjustable illumination to meet specific needs, ensuring optimal visibility and enhancing the quality of your projects.
As a proud CREE LED Solution Provider for over a decade, Marktech offers comprehensive engineering support, including design, binning, and material selection, alongside custom packaging options for specialized applications.
CREE LED through-hole emitters, designed for high-temperature and moisture environments with UV-resistant optical-grade epoxy, offer a range of colors for versatile applications in signage and lighting.
CREE High Brightness (HB) SMD LEDs are the brightest, most reliable architectural, video, signage, scoreboard, roadway, and specialty LEDs available today.
CREE LED’s P4 series represents a leap in LED design, combining efficiency with aesthetic versatility to meet the demands of modern lighting applications.
Marktech’s CREE LED XLamp® offerings on aluminum core starboards simplify LED integration for designers, providing a range of colors and angles on compact boards for easy testing and implementation in varied lighting applications.
Marktech Optoelectronics introduces its new product line of CREE LED die, including the EZ1350 Series Die, packaged in TO-cans (TO-18 and TO-39 outlines) designed for precision and reliability in demanding applications with protection against environmental factors like moisture and dust.
CREE LED’s Versatile InGaN-based LED chips are designed to meet diverse needs for blue, green, and white-converted LEDs.
Marktech Optoelectronics combines over 40 years of expertise in optoelectronics with a focus on customized engineering solutions, addressing specific customer needs and applications.
Custom photodiode detectors are designed to meet unique customer requirements, offering specialized performance features and cost savings through optimizations such as integrated filters, photodiode arrays, and hybridization.
Through our vertically integrated manufacturing facilities in California and Japan, we offer custom LED solutions, including packaging and optoelectrical categorization, enhancing product design and market readiness.
Multiple LED dies combined in a single package are engineered to address various applications across the UV, visible, NIR, SWIR, and MWIR spectral ranges.
To succeed, you need the exact optoelectronic package custom-designed and manufactured for your application, including hermetic metal SMD, TO-can, plastic SMD, and molded through-hole packaging.
Made-to-order semiconductor chips (die) and wafers are designed and fabricated to fit your needs. Standard dies are available in specific wavelengths for high-volume production applications.
Bare and encapsulated LEDs, photodiodes, and other components are assembled on FR4, metal-cored, and flexible circuit boards, ready for production.
Learn about the latest trends, devices, and potential applications.
The latest news and announcements from Marktech Optoelectronics.
Detailed information about common uses for Marktech Optoelectronics devices.
In depth discussions on LEDs, Detectors and the science behind them.
Become familiar with common terminology and concepts for LED Devices.
List of common concepts and definitions for Photodiodes.
LATHAM, NY, US, October 27, 2021 / — Marktech Optoelectronics, Inc. (www.marktechopto.com)(Marktech), a privately-held and veteran-owned leading designer and manufacturer of standard and custom optoelectronics, including UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters, detectors, InP epi wafers, and other compound semiconductors, is expanding their innovative optoelectronic packaging with:
Chip Scale Packaged SWIR LED Emitters – An Industry First
The availability of SWIR LEDs or emitters in a chip-scale packaged form factor is an industry first. The compactness of the new CSP SWIR LEDs is impressive. A dozen or more of Marktech’s CSP SWIR emitters would fit on the surface of a penny.
These Next-Generation CSP short wave IR emitters have an extremely small footprint compared to conventional short wave IR emitters in surface mount device (SMD) or transistor outline (TO) metal can packages. The new short wave IR emitters consist of a high-performance SWIR chip in an extremely compact 1.6mm x 1.6mm x 1.6 mm cube-shaped SMD package with two lead pads. The flat lens design produces a wide or Lambertian radiation pattern with beam angles of 130°. The high-performance CSP short wave infrared emitter products are available in wavelengths ranging from 1040 to 1650 nm.
1020nm and 1720nm CSP short wave IR emitters are available using conventional, lower power output SWIR chips. Marktech Optoelectronics can provide additional engineering and testing to deliver specific wavelengths and forward voltages as well as tighter power output bands through sorting or epi material customization. In machine vision and inspection, SWIR bandpass filters or longpass filters can be used in conjunction with SWIR light sources and SWIR cameras to adjust the bandwidth or pass only the SWIR light required for imaging – thereby increasing SWIR image contrast and resolution.
The major performance attributes of Marktech’s Chip Scale Packaged SWIR LED Emitters include:
Marktech Multi-wavelength and Multiple Chip Emitters and Detectors
In addition to advanced SWIR LED emitters, Marktech has multichip packaging capabilities, which can combine various NIR and SWIR LEDs and detectors within the same package for multispectral applications such as LED LIDAR and optical ranging sensors. Marktech also provides complementary products such as short wave IR InGaAs detectors for applications requiring both a SWIR light source combined with a SWIR sensor. A series of UV to SWIR emitters in a multichip package can provide a light source with a wide range of wavelengths for spectrometry and hyperspectral imaging. Marktech can bond from 2 to 144 die within the same package.
In summary, Marktech’s multichip packaging processes can provide within the same compact, surface mount, or hermetic package:
Marktech Optoelectronics can also provide chip-on-board (COB) packaging where multiple chips populate a ceramic or aluminum cored metal clad printed circuit board (Al-cored MCPCB). Chip-on-board (COB) might be the best choice to maximize heat dissipation when a design requires a very dense packaging of multiple emitters or LEDs. Aluminum core COB boards are available in linear, ring, and starboard formats.
ATLAS Hermetic SMD Packaging
Marktech’s CSP SWIR LED joins a growing family of advanced emitters and detectors in enhanced packaging such as Marktech’s ATLAS packaged line of LEDs, photodetectors, and emitter-detectors. The Marktech revolutionary ATLAS package combines the hermetic characteristics of a TO metal can packaged optoelectronic device with the great manufacturability associated with surface mount devices (SMDs). ATLAS packaged optoelectronic components are available in 3mm x 3mm and 5 mm x 5mm size. The ATLAS hermetic SMD packaging is constructed using a glass to ceramic seam welded process to provide water vapor and oxygen ingress protection.
Multiple wavelength LEDs or emitters and photodetectors can be packaged in the larger ATLAS package. ATLAS is an ideal package for applications requiring extreme sensitivity and high reliability because the seam-welded metal-to-ceramic seal in the ATLAS package prevents the ingress of water vapor and oxygen into the cavity holding the LED chips and photodetectors.
Using the ATLAS package technology, Marktech can engineer hermetic surface mount device (SMD) packages to hold and protect a wide range of SWIR LEDs, SWIR sensors, and custom LED-sensor combinations to your specific SWIR design application requirements in wavelengths ranging from 310 nm to 2600 nm. The hermetically sealed weld on the ATLAS ceramic SMD package provides excellent protection of chips from damaging high humidity environmental conditions. Marktech also has begun to offer standard or catalog products in the hermetic ATLAS package, such as Marktech’s MTSM1346SMF1-100 High-Speed InGaAs PIN Photodiode, which delivers IR to SWIR (600 nm to 1750 nm) photodetection.
Marktech’s Advanced Optoelectronic Packaging Family
In summary, Marktech’s advanced optoelectronic packaging family includes:
The high compactness and high power output of Marktech’s new CSP infrared LEDs, multichip packages, and ATLAS hermetic SMDs will enable engineers to shrink and enhance their optoelectronic design projects. Their adoption in product development projects will lead to breakthrough designs in many industrial applications.
If you have specific technical or application questions regarding your optoelectronic design project or are just interested in learning more about Marktech’s advanced packaging, emitters, and detectors, then please contact our application engineers: [email protected]
Gary Kardys
Marktech Optoelectronics
+1 518-956-2980
[email protected]
Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers.
Marktech Optoelectronics
3 Northway Lane North
Latham, NY 12110
Fax: +1-785-4725
Email: [email protected]
