The broadest line of both silicon and InGaAs detectors commercially available.
Indium Gallium Arsenide (InGaAs) PIN photodiodes are made using InGaAs/InP technology.
Cutting-edge silicon photodetectors that excel in precise detection of light ranging in wavelength from 250nm to 1100nm
Monolithic “quads” or quadrant photodiodes (QPDs) are 2 X 2 photodiode arrays with four planar diffused photodiode elements or segments.
Marktech offers a broad line of silicon photo Transistors in a variety of package types ranging from miniature metal can to ceramic packages.
Our High-Reliability Photoreflectors are sensors that contain both the LED emitter and photodetector functions within a single package.
Marktech Si APD’s offer low-level light and short pulse detections of wavelengths between 400 nm and 1100 nm.
UV detectors are offered in a variety of TO metal-can type packages from TO-18 to TO-39 with special UV glass lens to insure optimum lifetime and the least amount of material degradation
With the ability to detect light in the UV, visible, and infrared spectrums, photo detectors, photo transistors, and photodiodes are being used in increasingly more applications.
Marktech offers the broadest range of emitters commercially available ranging from 235nm to 4300nm across the UV, visible, NIR, SWIR, and MWIR spectral ranges.
Marktech offers the broadest range of UV LEDs commercially available ranging from 235nm to 400nm including UVA, UVB, UVC, and deep UVC LEDs.
Our advanced line of visible LED products is engineered to deliver high-quality, energy-efficient lighting solutions across various applications from 400nm to 700nm..
Our NIR LED wavelength range is typically from 700nm to 1000nm, extending into wavelengths invisible to the human eye but crucial for numerous technological and scientific applications.
Our standard product offering includes wavelengths from 1020nm to 4300nm and operating currents ranging from 20mA to 350mA for high-power applications.
Our Point Source LEDs are specifically engineered for optical encoders, edge sensors, and other critical applications that demand highly focused light with minimal dispersion.
Multi-LED chips in a single package, our multiple wavelength LEDs are engineered to address a myriad of applications across the UV, visible, NIR, SWIR, and MWIR spectral ranges
Designed to produce a highly defined red dot or reticle, facilitating accurate aiming without revealing the location to the target.
Ideally suited for applications including edge sensing, line sensing, coin bill validation, and bar code reading
Our panels are crafted to deliver uniform, vibrant illumination across a wide range of applications, from consumer electronics to industrial displays.
Crafted with the latest LED technology, these rings provide adjustable illumination to meet specific needs, ensuring optimal visibility and enhancing the quality of your projects.
As a proud CREE LED Solution Provider for over a decade, Marktech offers comprehensive engineering support, including design, binning, and material selection, alongside custom packaging options for specialized applications.
CREE LED through-hole emitters, designed for high-temperature and moisture environments with UV-resistant optical-grade epoxy, offer a range of colors for versatile applications in signage and lighting.
CREE High Brightness (HB) SMD LEDs are the brightest, most reliable architectural, video, signage, scoreboard, roadway, and specialty LEDs available today.
CREE LED’s P4 series represents a leap in LED design, combining efficiency with aesthetic versatility to meet the demands of modern lighting applications.
Marktech’s CREE LED XLamp® offerings on aluminum core starboards simplify LED integration for designers, providing a range of colors and angles on compact boards for easy testing and implementation in varied lighting applications.
Marktech Optoelectronics introduces its new product line of CREE LED die, including the EZ1350 Series Die, packaged in TO-cans (TO-18 and TO-39 outlines) designed for precision and reliability in demanding applications with protection against environmental factors like moisture and dust.
CREE LED’s Versatile InGaN-based LED chips are designed to meet diverse needs for blue, green, and white-converted LEDs.
Marktech Optoelectronics combines over 40 years of expertise in optoelectronics with a focus on customized engineering solutions, addressing specific customer needs and applications.
Custom photodiode detectors are designed to meet unique customer requirements, offering specialized performance features and cost savings through optimizations such as integrated filters, photodiode arrays, and hybridization.
Through our vertically integrated manufacturing facilities in California and Japan, we offer custom LED solutions, including packaging and optoelectrical categorization, enhancing product design and market readiness.
Multiple LED dies combined in a single package are engineered to address various applications across the UV, visible, NIR, SWIR, and MWIR spectral ranges.
To succeed, you need the exact optoelectronic package custom-designed and manufactured for your application, including hermetic metal SMD, TO-can, plastic SMD, and molded through-hole packaging.
Made-to-order semiconductor chips (die) and wafers are designed and fabricated to fit your needs. Standard dies are available in specific wavelengths for high-volume production applications.
Bare and encapsulated LEDs, photodiodes, and other components are assembled on FR4, metal-cored, and flexible circuit boards, ready for production.
Learn about the latest trends, devices, and potential applications.
The latest news and announcements from Marktech Optoelectronics.
Detailed information about common uses for Marktech Optoelectronics devices.
In depth discussions on LEDs, Detectors and the science behind them.
Become familiar with common terminology and concepts for LED Devices.
List of common concepts and definitions for Photodiodes.
The trend towards miniaturization in the electronics world is on-going and is fueled by a variety of factors including the consumer’s desire for portability as well as improved efficiency and reductions in costs. Over the past few years, LED (Light Emitting Diode) technology specifically, has seen tremendous growth, primarily due to the revolution in the lighting and general illumination markets. This increased interest in LEDs has also extended to a variety of other markets including military, medical and machine vision. Although LEDs are not new to these markets, their demand for smaller, higher resolution and uniform sources continues to grow.
FIGURE (1)
Essentially there are three basic categories of components in the LED environment. These are Through-Hole, Surface Mount and COB (Chip-On-Board). We will review these to help understand the miniaturization process regarding the design and use of LEDs for applications in these markets.
Through-hole LEDs have been commercially available since the 1960s. They come in a variety of body types but typically range in size from 3mm – 10mm in diameter (See figure 1).
These devices dominated the optoelectronics and technology sectors for more than 20 years. They are still widely used today in a variety of applications ranging from large digital displays and VMS (Variable Message Signs) to standard indicators for consumer or industrial electronics. Although these LED types are larger in size compared to the latest technological developments, there are still advantages to using through-hole devices such as integrated optics, ease of manufacturing and low cost. In addition, many display or VMS type applications do not require high resolution graphics or extensive color mixing for full color viewing.
It wasn’t until the 1980s and 90s when the cell phone and computer industries began their rapid escalation into the homes of every consumer, that the push for miniaturization commenced. Surface mount components, although actually developed in the 1960s, were rapidly replacing through-hole devices beginning in the late 1980s. This technology not only allowed for much higher circuit densities, thus significantly reducing size, but it also made automated assembly possible. Hand soldering became less and less necessary. Surface Mount Devices allowed for the mounting of components on both sides of the PCB or Printed Circuit Board as opposed to only one side. (See Figures 2A – 2B)
Figure (2A) – Through-Hole Front Side Populated, Back Side – soldering only, no components
Figure (2B) – Surface Mount Components on front and back of PCB
This in-turn had other advantages which included reduced manufacturing costs, improved thermal properties, increased reliability and faster turn-around time of assemblies. In addition, it was then possible to create high resolution displays as well as full color variable message signs utilizing red, green and blue LEDs. Blue LEDs also became commercially viable in the 1990s coinciding very well with the wide use of surface mount components. Surface mount devices have today become the product category of choice for most electronic design applications and come in a variety of package types and sizes. Some of the most common in the LED world range in size from 0402 which equates to .04″ x .02″, to 1210 or .12″ x .10″ with larger sizes for high powered devices. (See figure 3)
Figure (3)
Figure (4)
In the late 2000’s, a push for even greater efficiency and increased density for LEDs was occurring, once again, primarily driven by the lighting and general illumination market. This resulted in the widespread introduction and usage of COB (Chip-On-Board) technology. COB is a semiconductor technology where the “chip” also referred to as the “die” is mounted directly on the printed circuit board using a procedure called die attach or die bonding. The individual die are placed on the PCB by either using a conductive paste or soldering (Eutectic) method and then wire bonded. (See figure 4) This technology virtually eliminates the need for additional packaging such as lead frames and housings which allows for greater thermal dissipative qualities, reduced size and increased LED density (if required).
140pcs of a LED chip packaged into an area less than 1 square inch
There are still challenges with using COB technology especially from a manufacturing standpoint. Some of these include; (A) Capital expense – The equipment required is often very specialized and expensive (B) Uniformity and consistency is critical in many COB applications, therefore, the bare Die / Chip must be carefully selected and tested prior to placement on the PCB. This process also requires very specialized equipment and in addition, the yields must be considered to maintain a cost effective device. (C) Re-Work of COB assemblies can be difficult if already encapsulated. In some cases, the entire product must be discarded. If the product is able to be re-worked, typically, it can only be performed at the factory. Conversely, if the device is not encapsulated, re-work is relatively easy to perform compared to through-hole and SMT technology and less costly. (D) The quality, uniformity and type of PCB is critical to insure proper die attach and wire bond integrity. Pure, wire-bondable gold is often required.
COB technology is now being used by almost every major LED manufacturer, primarily in the general illumination and lighting marketplace. The increasing demand for energy efficient solutions to incandescent, halogen and similar antiquated technologies is allowing for rapid growth in the COB LED arena. As this technology continues to improve and costs decrease, the COB LED assembly market is expected to exceed the overall standard LED market in the next several years. Although most manufacturers are focused on energy efficient solutions to general illumination, there are a few select LED manufacturers who are using the many advantages of COB technology in more niche, highly specialized applications such as military, medical, machine vision and security.
An offshoot of COB technology which further increases efficiency and provides an even greater opportunity for miniaturization are the Direct Attach and Flip Chip methods of assembly. Both methods do not require wire bonding thus allowing for a lower profile COB assembly while improving performance. Currently, a limited number of LED manufactures are providing this type of die structure. In addition, there are even a smaller number of assemblers that are capable of properly mounting this type of die. A major supplier of DA die is Cree, Inc. An example of one of their DA type chips is shown in figure 5.
Figure (5) DA top and bottom view
140pcs of a LED chip packaged into an area less than 1 square inch
There are still challenges with using COB technology especially from a manufacturing standpoint. Some of these include; (A) Capital expense – The equipment required is often very specialized and expensive (B) Uniformity and consistency is critical in many COB applications, therefore, the bare Die / Chip must be carefully selected and tested prior to placement on the PCB. This process also requires very specialized equipment and in addition, the yields must be considered to maintain a cost effective device. (C) Re-Work of COB assemblies can be difficult if already encapsulated. In some cases, the entire product must be discarded. If the product is able to be re-worked, typically, it can only be performed at the factory. Conversely, if the device is not encapsulated, re-work is relatively easy to perform compared to through-hole and SMT technology and less costly. (D) The quality, uniformity and type of PCB is critical to insure proper die attach and wire bond integrity. Pure, wire-bondable gold is often required.
COB technology is now being used by almost every major LED manufacturer, primarily in the general illumination and lighting marketplace. The increasing demand for energy efficient solutions to incandescent, halogen and similar antiquated technologies is allowing for rapid growth in the COB LED arena. As this technology continues to improve and costs decrease, the COB LED assembly market is expected to exceed the overall standard LED market in the next several years. Although most manufacturers are focused on energy efficient solutions to general illumination, there are a few select LED manufacturers who are using the many advantages of COB technology in more niche, highly specialized applications such as military, medical, machine vision and security.
An offshoot of COB technology which further increases efficiency and provides an even greater opportunity for miniaturization are the Direct Attach and Flip Chip methods of assembly. Both methods do not require wire bonding thus allowing for a lower profile COB assembly while improving performance. Currently, a limited number of LED manufactures are providing this type of die structure. In addition, there are even a smaller number of assemblers that are capable of properly mounting this type of die. A major supplier of DA die is Cree, Inc. An example of one of their DA type chips is shown in figure 5.
The Direct Attach technique uses a flux eutectic bonding process which eliminates the need for solder paste, preforms or conductive adhesives. An appropriate flux and PCB is all that is required to achieve a high quality bond during the re-flow process. An example of an assembly made with standard COB technology versus DA bonding is shown in figures 6A – 6B.
Figure (6A)
Direct Attach assembly (Wire Bonding Required)
Figure (6B)
Direct Attach assembly (No Wire Bonding Required)
The Direct Attach technique uses a flux eutectic bonding process which eliminates the need for solder paste, preforms or conductive adhesives. An appropriate flux and PCB is all that is required to achieve a high quality bond during the re-flow process. An example of an assembly made with standard COB technology versus DA bonding is shown in figures 6A – 6B.
Flip chip technology flips over the LED in a face down orientation and places the electrodes in direct contact with the PCB. Like the Direct Attach process, this technology gives LED chips advantages that include a larger light-emitting area, better heat dissipation, along with eliminating the wire-bonding step and wire bond shadowing. The bonding method for flip chip die uses what are called solder “bumps”. The attachment process consists of applying the appropriate type of flux (as in the DA method) to these solder bump areas and then performing a reflow process. Due to the CTE (Coefficient of Thermal Expansion) mismatch between the flip chip and PCB, it is typically not recommended to use FR-4 material but a ceramic or optimized MC (Metal Core) substrate PCB. A major supplier of flip chip type die is Philips LumiLED. (See Figure 7)
Figure (7)
Flip Chip top view, bottom view and side view w/solder bumps
Both of these technologies are relatively new to LEDs but are beginning to make large inroads into the general illumination and niche marketplaces mentioned previously. In addition to some of the advantages described earlier, the reduction in thermal resistance going from a through-hole device to COB (see figure 8) will result in significant improvements in the lifetime and performance of the product.
Figure (8)
Thermal Resistance Comparison (Junction to Pad)
As with any new technology, it is critical to insure you are working with an organization that is experienced in optoelectronics, is aware of the advantages and disadvantages of through-hole, SMT or COB and is capable of providing the best option for your application.
Vincent is Chief Technology Officer of Marktech Optoelectronics in Latham, New York. He has been in the optoelectronics field for nearly 30 years and has authored or co-authored several articles relating to LED technology. Many significant enhancements to LEDs and their applications have directly resulted from Vincent’s input and hands-on experience.
Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers.
Marktech Optoelectronics
3 Northway Lane North
Latham, NY 12110
Fax: +1-785-4725
Email: [email protected]
