Maximize Your Total Cost Benefit with Tailored Photodiodes and LEDs for OEM Designs
Photodiodes and LEDs are widely used in a range of applications, including optical sensors, communication systems, medical diagnostic devices, analytical instruments, and application specific lighting. They are often used together to maximize the total cost benefit, with photodiodes serving as detectors and LEDs as emitters. By tailoring these components to OEM design needs, engineers can optimize performance while minimizing costs.
Photodiodes are semiconductor devices that convert light into an electrical current. They are commonly used in applications such as light detection and communication systems, where they can be used to detect changes in light intensity or to transmit data via optical signals. Photodiodes can be designed with different materials and structures, such as silicon, SiC, or InGaAs, to optimize their sensitivity and response time for specific applications.
LEDs, on the other hand, are semiconductor devices that emit light when a voltage is applied to them. They are commonly used as light sources in a range of applications, including displays, lighting, and communication systems. LEDs can also be designed with different materials and structures, such as GaN or InGaN, to optimize their emission wavelength and brightness for specific applications.
By combining photodiodes and LEDs together in the same package, engineers can create efficient and cost-effective systems. For example, in a communication system, an LED can be used to transmit data via optical signals, while a photodiode can be used to receive the signals and convert them back into electrical signals. By selecting the appropriate photodiode and LED components for the system, engineers can optimize the performance and cost of the system.
What is total cost benefit?
“Total cost benefit” refers to a comprehensive evaluation of both the financial and non-financial gains that can be derived from an investment, action, or decision, in relation to the total costs involved, including financial expenditures and potential risks. This approach does not just look at the monetary aspect but also considers other benefits such as improved safety, convenience, or time savings, while accounting for all associated costs including potential downstream or auxiliary costs.
To obtain a true sense of the total cost benefit, one needs to examine all potential gains and savings, direct and indirect, tangible and intangible, that may result from the decision, and then compare it against a fully loaded cost profile that encompasses every possible cost, direct and indirect, associated with that decision.
A total cost benefit analysis aims to provide a more rounded view of the value proposition of a decision by exploring it from multiple dimensions, and it is a critical tool in both business and policy making, aiding stakeholders in making informed decisions grounded on a holistic understanding of the potential outcomes. It offers a macro perspective, enabling a thorough evaluation and thereby facilitating choices that are aligned with long-term objectives and holistic wellbeing.
Maximizing Total Cost Benefit with Customization
To maximize the total cost benefit of photodiodes and LEDs, engineers should carefully consider the specific needs of their OEM designs. This includes selecting components that are optimized for the specific application, as well as components that are cost-effective and reliable. It also involves selecting components that are easy to integrate into the overall system design, with minimal additional components required.
For example, in a sensing system, the photodiode and LED components should be selected based on the desired sensitivity and wavelength range of the system. The components should also be selected based on their reliability and cost, with consideration given to the overall cost of the system. Additionally, the components should be designed with ease of integration in mind, to reduce the overall system complexity and cost. Standard or lower cost optoelectronic components often do not minimize the total system cost of a design or the “total cost of ownership”. For example, a design engineer may have planned on buying two separate photodiodes to meet the detection wavelength range requirements of the project. Marktech’s custom solution combined two photodiodes in the same package resulting in a lower total cost and less complicated design compared to purchasing two separate detectors.
In some cases, a detector has more gain than is required for a project. For these optoelectrical design projects, Marktech has custom developed lower active area detectors, which are less costly than a standard photodiodes with larger active areas.
Bacteria or microbes can have sensitivity to destruction at certain wavelengths. For instance, cryptosporidium is sensitive to or most effectively killed by 265nm light. In some sanitization cryptosporidium applications, mercury vapor lamps with a wide spectrum are used. Power is wasted because some of the wavelengths emitted are ineffective at destroying the bacteria Marktech can provide 265nm LEDs specifically targeting cryptosporidium eliminating providing a design with more energy efficiency and longer battery life. Likewise, Marktech can provide 235nm and 255nm deep UVC wavelengths for the detection of creatine, uric acid, proteins, nitrates in water or blood samples.
In addition, off-the-shelf parts frequently cannot provide the optimized performance of a bespoke detector or LED developed specifically for a new electro-optical product design. Even if the overall cost of the system is slightly higher using a custom part than a standard component, the performance per cost is higher or the total cost benefit is lower.
An intangible benefit is the competitive advantage provide provided by unique, custom LEDs or photodiodes. Bespoke optoelectronic parts can provide unique optoelectrical characteristic unlike any catalog type components. A design with a standard component can be more easily reversed engineered and then duplicated. Custom LEDs or custom detectors cannot be duplicated as easily or at all in some cases.
Tailoring LEDs and photodiodes to the specific design requirement can eliminate the need for additional component such as optical filters, amplifiers, lenses, etc. – resulting in lower system cost, higher product performance, or higher total cost benefit.
Photodiode Customization
- Material Selection: Photodiodes can be fabricated from different semiconductor materials, such as silicon, germanium, or InGaAs, depending on the wavelength range and sensitivity requirements of the OEM design. Each material types has characteristic ranges of wavelength sensitivity.
- Multi-detector Design: When a wide spectrum of wavelengths need to be detected, multiple wavelengths can be combined. Marktech can combine silicon and InGaAs photodiodes to provide a single detector package capable of detecting from
- Structure Design: The structure of the photodiode can be tailored for specific applications, such as PN photodiodes, PIN photodiodes, and avalanche photodiodes (APDs) to optimize for sensitivity, dark current, and response time.
- Optoelectronic Packaging: Photodiodes can be packaged in different formats, such as surface-mount packages, chip-on-board (COB), or ceramic packages, to meet the size and integration requirements of the OEM design.
- Active Area Size: The size of the active area of the photodiode can be customized to match the size of the light source or target in the OEM design, to optimize the detection efficiency. Photodiode for monitoring non-visible UV or IR light sources, often a very small area is sufficient. In applications where the transmitted or reflected light is very weak, a larger active area or multi-element photodiode can be developed to optimize photodetector response.
- Responsivity and Dark Current: The responsivity and dark current of the photodiode can be optimized by adjusting the doping concentration, bias voltage, or temperature, to meet the sensitivity and noise requirements of the OEM design.
- Optical Filters: Optical filters, such as bandpass filters or notch filters, can be integrated with the photodiode to improve the selectivity and reduce noise.
- Reverse Bias Voltage: The reverse bias voltage of the photodiode can be adjusted to control the sensitivity and saturation level, depending on the light intensity range of the OEM design.
By tailoring or customizing photodiodes to OEM specifications, engineers can optimize the performance and cost of their systems. The specific tailoring options chosen will depend on the specific application and requirements of the OEM design.
Table summarizing the customization types for photodiodes and their respective ranges/examples:
| Customization Type | Range/Example |
| Material Selection | Silicon, InGaAs, Other |
| Multiple Detectors | Si+InGaAs PDs, multiple SiPDs, multiple InGaAs PDs |
| Structure Design | PN, PIN, Array photodiode structures |
| Packaging | Surface-mount package, Chip-on-board (COB), Ceramic package, ATLAS Hermetic SMD package |
| Active Area Size | 0.1 mm² to 100 mm² |
| Responsivity and Dark Current | Responsivity: 0.1 A/W to 1 A/W, Dark Current: pA to µA |
| Optical Filters | Bandpass filter, Notch filter |
| Reverse Bias Voltage | 1 V to 100 V |
Note that the ranges/examples provided are not exhaustive and may vary depending on the manufacturer and specific application requirements.
LED Emitters Customization
Light emitting diodes (LEDs), also known as emitters, can be tailored or customized to meet specific OEM specifications in various ways. Here are some examples::
- Material Selection: LEDs can be fabricated from different semiconductor materials, such as GaN, InGaN, or AlInGaP, depending on the desired emission wavelength and brightness of the OEM design.
- Sorting/Binning: LEDs can be sorted or binned to ensure consistent performance within a specific range of parameters, such as emission wavelength or brightness.
- Structure Design: The structure of the LED can be tailored for specific applications, such as high-brightness LEDs or surface-emitting LEDs, to optimize the brightness and efficiency.
- Packaging: LEDs can be packaged in different formats, such as TO-can, plastic through hole, PLCC SMD, COB, or multichip-multiwavelength, depending on the size and integration requirements of the OEM design.
- Lens Types: The LED can be equipped with different lens types, such as flat, dome, or ball lenses, to optimize the light output and directionality for the OEM design.
- Substrate Material: The substrate material of the LED can be customized to improve thermal management, such as using silicon carbide (SiC) or diamond substrates for high-power LEDs.
- Current Density: The current density of the LED can be adjusted by changing the size and number of the semiconductor layers, to optimize the brightness and efficiency for the OEM design.
- Thermal Resistance: The thermal resistance of the LED can be optimized by selecting appropriate packaging and substrate materials, to ensure stable and efficient operation under different environmental conditions.
- ESD Protection: The LED can be equipped with electrostatic discharge (ESD) protection features to improve its reliability and durability in high-voltage or high-static environments.
- Customized Pin Configuration: The pin configuration of the LED can be customized to suit the OEM design’s specific requirements.
- ATLAS Hermetic SMD Packaging: ATLAS Hermetic SMD packaging can be used to create more rugged and durable LED packages that can withstand harsh environments.
Table summarizing LED customization types and their respective ranges/examples:
Customization Type
Range/Example
Material Selection
GaN, InGaN, AlInGaP
Sorting/Binning
Emission wavelength sorting tolerance: +/- 1 nm
Structure Design
High-brightness LED, Surface-emitting LED
Packaging
TO-can, Plastic through hole, PLCC SMD, COB, Multichip-multiwavelength, ATLAS Hermetic SMD package
Lens Types
Flat, Dome, Ball lenses
Substrate Material
Aluminum oxide, ALON, SiC, etc.
Current Density
1 A/cm² to 100 A/cm²
Thermal Resistance
0.1 K/W to 10 K/W
ESD Protection
> 4 kV HBM (Human Body Model)
Customized Pin Configuration
2-pin, 3-pin, 4-pin, etc.
ATLAS Hermetic SMD Packaging
Rugged and durable packaging that can withstand harsh environments
Note that the ranges/examples provided are not exhaustive and may vary depending on the manufacturer and specific application requirements.
Conclusion
photodiodes and LEDs are powerful tools for optimizing the cost and performance of OEM designs. By selecting the appropriate components and tailoring them to the specific needs of the application, engineers can create efficient and cost-effective systems. With careful consideration of the performance and cost trade-offs, photodiodes and LEDs can be used to create systems that maximize the total cost benefit for OEM designs with the additional benefit of providing unique features, which are difficult for competitors to duplicate.