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The success of any optoelectronic component and assembly is predicated on the quality of the chip. Cree is a recognized leader in high performance materials. Their advanced technology and manufacturing techniques allow for the maximum light output of each chip size.

Additional chip sorting is available from Marktech, please contact us to discuss your application needs.

Please see additional Die series details below the product chart.

Click column headers to sort, click the same column again to change sort direction

Part Number Color Peak Wavelength Package Specs
MTE5270P-C Green 527 TO-18 Metal Can Domed Lens (2 pin)
MTE6000P-C PC Amber 600 TO-18 Metal Can Domed Lens (2 pin)
MTE4600L-HP Blue 450 TO-39 Metal Can Domed Lens (2 pin)
MTE4600N Blue 450 TO-18 Metal Can Domed Lens (2 pin)
MTE5270N Green 527 TO-18 Metal Can Domed Lens (2 pin)
MTE6000N PC Amber 600 TO-18 Metal Can Domed Lens (2 pin)
MTE6000L-HP PC Amber 600 TO-39 Metal Can Domed Lens (2 pin)


DA LED Chip Series
Cree's Direct Attached LED die incorporate a bondpad-down design that allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance from improved thermal management.

GaN LED Chip Series
CB Super Blue Chips allows for low current and deliver the ultimate price/performance for blue leds.

Cree's TR™ LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree's proprietary device technology and silicon carbide substrates to deliver superior value for the LCD sideview market. The TR LEDs are among the brightest in the sideview market while delivering a low forward voltage resulting in a very bright and highly efficient solution for the 0.4-mm, 0.6-mm and 0.8-mm sideview market. The design is optimally suited for industry-standard sideview packages as it is die attachable with clear epoxy and has two top contacts, consistent with industry-standard packaging.

EZ LEDs combine highly efficient InGaN materials with Cree's proprietary optical design and wafer-level submount technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern ideal for many applications.

Cree's MB Generation II series of MegaBright© LEDs combine highly efficient InGaN materials with Cree's proprietary G•SiC© substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced vertical chip structure to maximize light extraction efficiency and require only a single wire bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant flux bins. Cree's MB series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V ESD.

These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree's MB series chips are compatible with most radial and SMT LED assembly processes.

Razor Thin LED Chip Series
Cree RT LEDs deliver superior price/performance for high-intensity blue and green LEDs. They are well suited for applications where thinner form factors are required, such as

  • Audio product display lighting
  • Mobile appliance keypads
  • Automotive applications
  • LCD Backlighting Units
  • Cellular Phone LCD Backlighting
  • LED Video Displays
Cree's original RT LEDs are available in two lines, the 230 and 290, both of which come in 5 mA and 20 mA versions. The new RT Gen III LEDs are available in three lines, the 200, 260 and 320.

Like all Cree LEDs, RT LEDs combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate. These LEDs also have a single wire-bond structure. Cree RT series chips are compatible with most radial and SMT LED assembly processes.

Cree's UltraThin© LEDs combine highly efficient InGaN materials with Cree's proprietary G•SiC© substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree's UT™ series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000-V ESD.

Applications include keypad backlighting where sub-miniaturization and thinner form factors are required.

Cree UT LEDs are available in three lines, 190, 200 and 230. Their features include:

  • Small chip
  • Single wire bond structure
  • Class 2 ESD rating

Like all Cree LEDs, UT LEDs combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced design to maximize light-extraction efficiency.

Cree UT series chips are compatible with most radial and SMT LED assembly processes.

XThin LEDs
Cree's XT line of LEDs are ideal for applications where sub-miniaturization and high brightness are required. Such applications include

  • Cellular phone backlighting
  • Digital camera flash for mobile appliances
  • Mobile phone keypads in white, blue or green
  • Audio product display lighting
  • ESS / outdoor displays

Like all Cree LEDs, XT LEDs combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and die-to-package heat dissipation.